Semiconductor flip chip package having substantially non-collapsible spacer

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7880313
APP PUB NO 20060192295A1
SERIAL NO

11282293

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has a spacer to maintain a separation between the die and the die paddle. Also, methods for making the package are disclosed.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
STATS CHIPPAC PTE LTE5 YISHUN STREET 23 SINGAPORE

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Alvarez, Sheila Singapore, SG 1 87
Dahilig, Frederick Singapore, SG 2 92
Goh, Hin Hwa Singapore, SG 33 586
Kim, Geun Sik Sungnam, KR 8 214
Lee, Jae Soo Ichoen-si, KR 25 138
Quiazon, Robinson Singapore, SG 6 147

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation