Method for making chip resistor components
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United States of America Patent
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Feb 8, 2011
Grant Date -
Sep 3, 2009
app pub date -
Feb 29, 2008
filing date -
Feb 29, 2008
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Abstract
A method for making chip resistor components includes: (a) forming a plurality of first and second notches in a substrate so as to form resistor-forming strips; (b) forming pairs of upper and lower electrodes on each of the resistor-forming strips; (c) forming a resistor film on each of the resistor-forming strips; (d) forming an insulator layer on the resistor film; (e) forming a hole pattern in the insulator layer and the resistor film; (f) forming an insulating shield layer on the insulator layer; (g) cleaving the substrate along the first notches so as to form a plurality of strip-like semi-finished products; (h) forming a pair of side electrodes on two opposite sides of each of the semi-finished products; and (i) cleaving each of the semi-finished products.

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- 10 France
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- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
YAGEO CORPORATION | KAOHSIUNG CITY |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Chang, Chi-Pin | Taipei Hsien, TW | 1 | 14 |
Chen, Mu-Yuan | Taipei Hsien, TW | 2 | 14 |
Chien, Kao-Po | Taipei Hsien, TW | 1 | 14 |
Wu, Wen-Feng | Taipei Hsien, TW | 3 | 39 |
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Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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