Free-cutting copper alloy containing very low lead

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United States of America Patent

PATENT NO 7883589
APP PUB NO 20070062615A1
SERIAL NO

11420623

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Abstract

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The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially satisfactory machinability. The free-cutting alloys comprise 71.5 to 78.5 percent, by weight, of copper, 2.0 to 4.5 percent, by weight, of silicon, 0.005 percent up to but less than 0.02, by weight, of lead, and the remaining percent, by weight, of zinc.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI SHINDOH CO LTDTOKYO 140-8550

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Oishi, Keiichiro Yao, JP 78 383

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