Semiconductor device with semiconductor chip and rewiring layer and method for producing the same
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United States of America Patent
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Feb 8, 2011
Grant Date -
Nov 2, 2006
app pub date -
Jun 28, 2006
filing date -
Nov 11, 2003
priority date (Note) -
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Abstract
The invention relates to a semiconductor device with a semiconductor chip and a rewiring layer, the semiconductor chip being embedded in a housing plastics composition by its rear side contact. The active top side of the semiconductor chip forms a coplanar overall top side with the top side of the housing plastics composition. The rear side contact is led to the overall top side via a flat conductor sheet tape, so that the rear side contact of the semiconductor chip can be accessed from the overall top side.
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