Resin composition, method of producing same, and foam-insulated electric wire

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United States of America Patent

PATENT NO 7884148
APP PUB NO 20070149671A1
SERIAL NO

11713696

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Abstract

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The present invention provides a resin composition containing a filler poor in affinity for fluororesins as uniformly dispersed therein and a method of producing such resin composition and, further, a resin composition containing, as fillers, a nucleating agent for foaming and suited for producing foamed moldings with fine foam cells uniformly distributed therein and a method of producing such resin composition as well as a foamed molding formed from either of such resin compositions. The present invention is related to a resin composition comprising a fluororesin (A) and a filler (X) low in affinity for said fluororesin (A), wherein the filler (X) has a d99 value of not more than 15 μm.

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Patent Owner(s)

Patent OwnerAddress
DAIKIN INDUSTRIES LTDOSAKA UMEDA TWIN TOWERS SOUTH 1-13-1 UMEDA KITA-KU OSAKA-SHI OSAKA 5300001 ?5300001

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujita, Eiji Settsu, JP 23 163
Fukuoka, Shouji Settsu, JP 6 49
Higuchi, Tatsuya Settsu, JP 63 207
Shiotsuki, Keizou Settsu, JP 12 40
Taira, Takahiro Settsu, JP 31 105

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