System-in-package and manufacturing method of the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Feb 8, 2011
Grant Date -
Dec 31, 2009
app pub date -
Jun 30, 2008
filing date -
Jun 30, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention discloses a structure of package comprising: a substrate with a die receiving through hole and a contact conductive via formed therein, a die disposed within the die receiving through hole, a surrounding material filled in the gap except the die area of the die receiving though hole, a re-distribution layer formed on the substrate and coupled to the contact conductive via, a protection layer formed over the re-distribution layer, a cover material formed over the protection layer; and a terminal contact pad formed on the lower surface of the substrate and under the contact conductive via and the die to couple the contact conductive via.
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