Process for forming an isolated electrically conductive contact through a metal package
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United States of America Patent
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Feb 15, 2011
Grant Date -
Nov 27, 2008
app pub date -
May 25, 2007
filing date -
May 25, 2007
priority date (Note) -
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Abstract
A method of forming an isolated electrically conductive contact through a metal substrate by creating at least one via through the substrate. The at least one sidewall of the via is cleaned and coated with a non-conductive layer. In one example, the non-conductive layer is formed by anodizing the sidewall(s) of the via. In another example, the non-conductive layer may be formed by thin film deposition of a dielectric on the sidewall(s). An electrically conductive filler is then placed into the via. In the examples disclosed, the filler may be a conductive ink or a conductive epoxy.
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