Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof
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United States of America Patent
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Feb 15, 2011
Grant Date -
Dec 24, 2009
app pub date -
May 27, 2009
filing date -
Jun 20, 2008
priority date (Note) -
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a shaped platform with a conductive post; mounting the shaped platform with the conductive post over a temporary carrier; mounting an integrated circuit device over the temporary carrier; encapsulating the conductive post and the integrated circuit device; removing a portion of the shaped platform isolating the conductive post; and removing the temporary carrier.
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