Aromatic polyamide and epoxy group-containing phenoxy resin
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United States of America Patent
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Feb 15, 2011
Grant Date -
Aug 27, 2009
app pub date -
May 17, 2006
filing date -
May 20, 2005
priority date (Note) -
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Abstract
A polyamide resin composition which can improve heat resistance and water absorbency while suppressing the deterioration of processability is provided. Provided is a polyamide resin composition having an aromatic polyamide resin and an epoxy group-containing phenoxy resin having an epoxy group in the molecule of the phenoxy resin, wherein the content of the epoxy group-containing phenoxy resin is 30 to 50% by mass.
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