Loading device of chemical mechanical polishing equipment for semiconductor wafers
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United States of America Patent
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Feb 22, 2011
Issued Date -
N/A
app pub date -
Jul 21, 2006
filing date -
Nov 25, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
A loading device of chemical mechanical polishing (CMP) equipment for processing semiconductor wafers is provided. The loading device includes a loading cup having a cup-like bath, a cup plate installed in the bath, and a loading plate supported on the cup plate for absorbing shock and seating the wafer. A driving device and a driving shaft horizontally pivot and vertically move the loading cup between a platen of a polishing apparatus and a spindle. An arm connects the loading cup and the driving shaft. At least one through hole is located in a mutually corresponding position of the bath, the cup plate, and the loading plate of the loading cup. A probe assembly optically detects a polished thickness at a polished point on the wafer.
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