Precursors for porous low-dielectric constant materials for use in electronic devices
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United States of America Patent
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Feb 22, 2011
Grant Date -
Aug 7, 2008
app pub date -
Feb 26, 2008
filing date -
Nov 16, 1999
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Abstract
Precursors are provided for dielectric compositions that are useful in the manufacture of electronic devices such as integrated circuit devices and integrated circuit packaging devices. The dielectric compositions are prepared by crosslinking a thermally decomposable porogen to a host polymer via a coupling agent, followed by heating to a temperature suitable to decompose the porogen. The porous materials that result have dielectric constants of less than 2.4.
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