Hermetic implantable sensor
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United States of America Patent
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Feb 22, 2011
Grant Date -
N/A
app pub date -
Aug 23, 2004
filing date -
Feb 13, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
At least one conductor is formed at a preselected location on a substrate made of a first insulating material having a high temperature resistance. The conductor is made from a solidified electrically conductive thick film material. A coating made of a second insulating material is formed over the substrate to hermetically seal at least a portion of the conductor. An exposed distal region of the conductor provides a detection electrode. The conductor has a reduced porosity that inhibits migration of fluid or constituents thereof through the conductor.
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Family
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