Nanotube materials for thermal management of electronic components
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United States of America Patent
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Mar 1, 2011
Grant Date -
Nov 30, 2006
app pub date -
Apr 28, 2006
filing date -
May 26, 2005
priority date (Note) -
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Abstract
A heat-conducting medium for placement between a heat source and heat sink to facilitate transfer of heat from the source to the sink is provided. The heat-conducting medium can include a flexible member made from an array of interweaving carbon nanotubes. The heat-conducting medium may also include an upper surface against which a heat source may be placed, an opposing lower surface and edges about the member designed for coupling to a heat sink toward which heat from the heat source can be directed. The heat-conducting medium may also include a pad placed on the upper surface to provide structural support to the member. A method for manufacturing the heat-conducting medium is also provided.
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