High-speed substrate manipulator
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United States of America Patent
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Mar 1, 2011
Grant Date -
Jul 10, 2008
app pub date -
Jan 5, 2007
filing date -
Jan 5, 2007
priority date (Note) -
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Abstract
A mechanism for manipulation of a substrate over a substantially planar region has at least three, and up to six, degrees of freedom (DOF). The mechanism may be manufactured in various configurations, including triangular, and may use inherent symmetry to reduce the number of distinct components that must be manufactured. The mechanism may use parallelism to reduce the moving mass and thereby achieve higher levels of performance using less expensive motors while dissipating less power.
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