Method for conditioning semiconductor wafers and/or hybrids
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United States of America Patent
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Mar 8, 2011
Grant Date -
Oct 13, 2005
app pub date -
Apr 15, 2003
filing date -
Apr 15, 2002
priority date (Note) -
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Abstract
The present invention provides a method for conditioning semiconductor wafers and/or hybrids having the steps: preparation of a space (1) which is at least partially enclosed and has a wafer/hybrid holding device (10) which is located therein and has the purpose of holding a semiconductor wafer and/or hybrid; and conduction of a dry fluid through the wafer/hybrid holding device (10) in order to heat-treat the wafer/hybrid holding device (10); wherein at least a portion of the fluid leaving the wafer/hybrid holding device (10) is used to condition the atmosphere within the space (1). The invention also provides a corresponding device for conditioning semiconductor wafers and/or hybrids.
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