Resonating conductive traces and methods of using same for bonding components
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United States of America Patent
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Mar 8, 2011
Grant Date -
Dec 13, 2007
app pub date -
May 29, 2007
filing date -
May 30, 2006
priority date (Note) -
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Abstract
Conductive traces and patterns of same are used to bond components together via electromagnetic radiation. Each conductive trace is configured to resonate and heat up when irradiated with electromagnetic radiation, such as microwave energy and/or RF energy, having a wavelength that is about 2.3 times the length of the conductive trace. The conductive traces may be arranged in a pattern to uniformly heat a target area of a substrate or other component to a selected temperature when irradiated with electromagnetic radiation.
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