Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

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United States of America Patent

PATENT NO 7902643
APP PUB NO 20080054444A1
SERIAL NO

11514568

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Microfeature workpieces having interconnects and conductive backplanes and associated systems and methods are disclosed herein. One such device includes a semiconductor substrate having integrated circuitry and terminals electrically coupled to the integrated circuitry. The device also includes electrically conductive interconnects extending through at least a portion of the semiconductor substrate and electrically coupled to corresponding terminals. The device further includes a conductive backplane assembly having a conductive layer at a back side of the semiconductor substrate. One or more of the interconnects are electrically coupled to the conductive layer at the back side of the semiconductor substrate.

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tuttle, Mark E Boise, US 288 10536

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