Apparatus and method for stacking integrated circuits
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 8, 2011
Grant Date -
Mar 17, 2005
app pub date -
Sep 28, 2004
filing date -
May 25, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A multi-chip stack module provides increased circuit density for a given surface chip footprint. The multi-chip stack module comprises support structures alternating with standard surface mount type chips to form a stack wherein the support structures electrically interconnect the chips. Various embodiments disclose a structure and method for interconnecting a plurality of generally planar chips in a vertical stack such that common signals are connected in the stack and individually-accessed signals are separated within the stack.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully