Method and apparatus for leak-proof mounting of a liquid cooling device on an integrated circuit
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United States of America Patent
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Mar 15, 2011
Grant Date -
Aug 9, 2007
app pub date -
Feb 7, 2007
filing date -
Feb 9, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Apparatus for cooling of an electrical circuit element on an electrical element package, comprising in combination, structure including a hollow body defining a cavity for containing cooling fluid located in heat transfer relation with said element, a rotatably tightenable connection between said package and said hollow body, and acting to block leakage of cooling fluid from said cavity.
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