Lid assembly for a processing system to facilitate sequential deposition techniques
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United States of America Patent
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Mar 15, 2011
Issued Date -
N/A
app pub date -
Nov 19, 2004
filing date -
Jul 16, 2001
priority date (Note) -
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Abstract
A lid assembly for a semiconductor processing system is provided. The lid assembly generally includes a lid having first and second opposed surfaces, a plurality of controllable flow channels extending from the first and second opposed surfaces and a gas control system disposed on the first surface and operably opening and closing the channels. The gas control system includes a gas manifold disposed on the lid, at least one valve coupled to the gas manifold and adapted to control a flow through one of the flow channels, a reservoir fluidly connected to the gas manifold, and a precursor source fluidly connected to the reservoir.
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