Method of manufacturing a semiconductor device with a peeling prevention layer
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United States of America Patent
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Mar 15, 2011
Grant Date -
Oct 16, 2008
app pub date -
Apr 25, 2008
filing date -
Sep 29, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A peeling prevention layer for preventing an insulation film and a protection layer from peeling is formed in corner portions of a semiconductor device. The peeling prevention layer can increase its peeling prevention effect more when formed in a vacant space of the semiconductor device other than the corner portions, for example, between ball-shaped conductive terminals. In a cross section of the semiconductor device, the peeling prevention layer is formed on the insulation film on the back surface of the semiconductor substrate, and the protection layer formed of a solder resist or the like is formed covering the insulation film and the peeling prevention layer. The peeling prevention layer has a lamination structure of a barrier seed layer and a copper layer formed thereon when formed by an electrolytic plating method.
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