Radial block copolymers and adhesives based thereon with improved die-cutting performance
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United States of America Patent
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Mar 15, 2011
Grant Date -
May 28, 2009
app pub date -
Oct 31, 2007
filing date -
Sep 25, 2001
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Abstract
Improved adhesives are provided through the use of styrenic radial block copolymers, containing at least 40 wt % diblock copolymers, the adhesives have improved adhesive properties and a reduced elastic behavior under die-cutting conditions. Compared to conventional linear block copolymers of similar molecular weight, radial copolymers offer higher holding power and lower melt viscosity for the adhesive. They therefore contribute to an improved balance between processability and end-use properties.
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