Structure of circuit board and method for fabricating same
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United States of America Patent
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Mar 15, 2011
Grant Date -
Jun 21, 2007
app pub date -
Oct 27, 2006
filing date -
Dec 20, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
A circuit board structure and a method for fabricating the same are proposed. The structure includes an insulating protective layer having a plurality of openings in which conductive vias are formed, a patterned circuit layer formed on the surface of the insulating protective layer and electrically connected to the conductive vias in the openings of the insulating protective layer, and a dielectric layer formed on the insulating protective layer and on the surface of the patterned circuit layer, wherein a plurality of openings are formed in the dielectric layer to thereby expose parts of the patterned circuit layer. Accordingly, the present invention reduces the thickness of a circuit board, which reduces package size, improves product performance, and conforms to the developmental trend toward smaller electronic devices.
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