Molded integrated circuit package and method of forming a molded integrated circuit package
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United States of America Patent
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Mar 15, 2011
Grant Date -
N/A
app pub date -
Mar 13, 2008
filing date -
Mar 13, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
A molded integrated circuit package is described. The molded integrated circuit package comprises a substrate having a plurality of contacts on a first surface; a die having a plurality of solder bumps on a first surface, the plurality of solder bumps being coupled to the plurality of contacts on the first surface of the substrate; an adhesive material positioned on a second surface of the die; a lid attached to the adhesive material; and an encapsulant positioned between the lid and the substrate. Methods of forming molded integrated circuit packages are also disclosed.
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