Semiconductor device
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United States of America Patent
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Mar 15, 2011
Grant Date -
Apr 30, 2009
app pub date -
Oct 26, 2007
filing date -
Oct 26, 2007
priority date (Note) -
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Abstract
A semiconductor device is disclosed. One embodiment provides an arrangement of a plurality of semiconductor chips arranged side by side in a spaced apart relationship. A first material fills at least partly the spacings between adjacent semiconductor chips. A second material is arranged over the semiconductor chips and the first material. A coefficient of thermal expansion of the first material is selected to adapt the lateral thermal expansion of the arrangement in a plane intersecting the first material and the semiconductor chips to the lateral thermal expansion of the arrangement in a plane intersecting the second material.
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