Detachable electrostatic chuck for supporting a substrate in a process chamber
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United States of America Patent
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Mar 15, 2011
Grant Date -
Aug 13, 2009
app pub date -
Dec 4, 2008
filing date -
Mar 31, 2004
priority date (Note) -
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Abstract
A substrate support has an electrostatic chuck comprising an electrostatic puck with a dielectric covering an electrode capable of being charged to energize a process gas. The chuck has a frontside surface to receive a substrate and a base plate having an annular flange. A spring loaded heat transfer plate contacts the base plate, and has a fluid channel comprising first and second spiral channels. A pedestal is below the heat transfer plate.
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