Method for assembling testing equipment for semiconductor substrate
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United States of America Patent
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Mar 22, 2011
Grant Date -
Oct 26, 2006
app pub date -
Apr 20, 2006
filing date -
Apr 20, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Upon an assembly of a probe head unit, the relative positions of the probe pins 28ai to those of the electrode group 24E in the pitch-changing substrate 24 are determined by making the positions of the through-holes 26A, 26B, 26C and 26D in the contact block 26 to coincide with the positioning marks 24MA, 24MB, 24MC and 24MD in the pitch-changing substrate 24.
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