Photosensitive resin composition and flexible printed wiring circuit board having insulative cover layer formed of photosensitive resin composition
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 22, 2011
Grant Date -
Apr 23, 2009
app pub date -
Oct 16, 2008
filing date -
Oct 17, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A photosensitive resin composition which is excellent in flame resistance, resolution and flexibility, and substantially free from deposition of components thereof to prevent contamination of a product. The photosensitive resin composition comprises:(A) a cyclic phosphazene compound represented by the following general formula (1):wherein at least one of the Rs is an organic group having the urethane(meth)acrylate structure represented by the following general formula (2) and n is a positive number of 2 to 5:wherein the cyclic phosphazene compound (A) is present in a proportion of 5 to 30 wt % based on the total weight of the composition.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully