Multilayered printed circuit board, solder resist composition, and semiconductor device
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United States of America Patent
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Mar 22, 2011
Grant Date -
Feb 21, 2008
app pub date -
Aug 14, 2007
filing date -
Aug 12, 1999
priority date (Note) -
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Abstract
The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition and a solder resist layer formed as an outermost layer, and the solder resist layer contains an inorganic filler.
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