Electro-conductive contact structure for enclosure sealing in housings
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United States of America Patent
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Mar 22, 2011
Grant Date -
May 27, 2010
app pub date -
Nov 26, 2008
filing date -
Nov 26, 2008
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An electro-conductive contact structure for sealing the interior of an enclosure from interference includes first and second electro-conductive contact surfaces. In one embodiment, the first electro-conductive contact surface includes a plurality of projections, and the second electro-conductive contact surface includes a plurality of slots. The projections are configured for insertion into the slots to form an electro-conductive interface between the first and second portions of the enclosure. In another embodiment, the electro-conductive contact structures are formed on first and second housing parts, respectively. In another embodiment, the electro-conductive contact surfaces each include a series of fingers and a plurality of pockets between the fingers.
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