Through-chip via interconnects for stacked integrated circuit structures
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 22, 2011
Grant Date -
Mar 5, 2009
app pub date -
Aug 29, 2007
filing date -
Aug 29, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A stacked IC structure has an integrated circuit (IC) having a front IC side, a back IC side, and a first conductive feature formed on the front IC side. A through-chip via connects to the first conductive feature on the front IC side. A substrate has an external circuit formed on a front surface. The IC attaches to the front surface of the substrate and the through-chip via forms a connection between the first conductive feature and the external circuit.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully