Cleaning cup system for chemical mechanical planarization apparatus
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United States of America Patent
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Mar 29, 2011
Grant Date -
Aug 28, 2008
app pub date -
Feb 7, 2008
filing date -
Feb 7, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention is related to an improved cleaning cup arrangement for CMP systems that efficiently and effectively removes most, if not all, of any slurry material present on the abrasive conditioning disk and conditioner head as they are resting in the cup between conditioning cycles. The cleaning cup of the present invention includes an underside water knife for directing a high velocity stream of cleaning fluid against the rotating abrasive disk (or conditioning brush, which may be used instead of a disk) surface, and at least a pair of spray stems for directing columns of cleaning fluid with sufficient cleaning force against all exposed portions of the conditioner head.
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