Stackable multi-chip package system with support structure
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United States of America Patent
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Mar 29, 2011
Grant Date -
Mar 4, 2010
app pub date -
Nov 9, 2009
filing date -
Aug 4, 2006
priority date (Note) -
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Abstract
A stackable multi-chip package system is provided including forming an external interconnect, having a base and a tip, and a paddle; mounting a first integrated circuit die over the paddle; stacking a second integrated circuit die over the first integrated circuit die in a active side to active side configuration; connecting the first integrated circuit die and the base; connecting the second integrated circuit die and the base; and molding the first integrated circuit die, the second integrated circuit die, the paddle, and the external interconnect with the external interconnect partially exposed.
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