Lead assembly including a polymer interconnect and methods related thereto
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United States of America Patent
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Mar 29, 2011
Grant Date -
Mar 6, 2008
app pub date -
Aug 31, 2006
filing date -
Aug 31, 2006
priority date (Note) -
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Abstract
A lead assembly includes a ring component having mechanical coupling features, and at least one polymer component mechanically coupled with the mechanical coupling features of the ring component. Elongate tubing is disposed over the polymer component and is secured with the polymer component.
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