Formation of a hybrid integrated circuit device
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United States of America Patent
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Apr 5, 2011
Grant Date -
Jun 25, 2009
app pub date -
Dec 20, 2007
filing date -
Dec 20, 2007
priority date (Note) -
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Abstract
Formation of a hybrid integrated circuit device is described. A design for the integrated circuit is obtained and separated into at least two portions responsive to component sizes. A first die is formed for a first portion of the hybrid integrated circuit device using at least in part a first minimum dimension lithography. A second die is formed for a second portion of the device using at least in part a second minimum dimension lithography, where the second die has the second minimum dimension lithography as a smallest lithography used for the forming of the second die. The first die and the second die are attached to one another via coupling interconnects respectively thereof to provide the hybrid integrated circuit device.
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