Stacked semiconductor component having through wire interconnect
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United States of America Patent
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Apr 5, 2011
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N/A
app pub date -
Feb 10, 2010
filing date -
Apr 8, 2005
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Abstract
A stacked semiconductor component includes a plurality of semiconductor substrates in a stacked array and a continuous wire extending through aligned vias on the semiconductor substrates of the stacked array in electrical contact with contacts on the semiconductor substrates. A method for fabricating the semiconductor component includes the steps of stacking the semiconductor substrates in a stacked array with aligned vias; threading a wire through the aligned vias; and forming a plurality of electrical connections between the wire and the contacts on the semiconductor substrates.
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