Coaxial through chip connection
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United States of America Patent
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Apr 5, 2011
Issued Date -
N/A
app pub date -
Nov 6, 2006
filing date -
Jun 14, 2005
priority date (Note) -
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Abstract
An integrated circuit chip includes devices formed by doping of a semiconductor on a substrate and at least one post-device formation through-chip via made up of an annulus of insulating material, an annulus of metallization bounding an outer surface of the annulus of insulating material and an annulus of electrically conductive material within the annulus of insulating material, the annulus of metallization and the annulus of electrically conductive material being electrically isolated from each another.
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