Semiconductor package and method therefor
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United States of America Patent
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Apr 19, 2011
Grant Date -
May 9, 2002
app pub date -
Aug 13, 2001
filing date -
Sep 4, 1996
priority date (Note) -
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Abstract
A semiconductor package substrate (11) has an array of package sites (13, 14, 16, and 21) that are substantially identical. The entire array of package sites (13, 14, 16, and 21) is covered by an encapsulant (19). The individual package sites (13, 14, 16, and 21) are singulated by sawing through the encapsulant (19) and the underlying semiconductor package substrate (11).
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