Multilevel ground-plane for a mobile device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 19, 2011
Grant Date -
Mar 27, 2008
app pub date -
Sep 20, 2005
filing date -
Sep 21, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In accordance with the teachings described herein, a multilevel ground-plane for a mobile device is provided. The multilevel ground-plane includes a first conductive surface, a second conductive surface, and a conducting strip that couples the first conducting surface to the second conducting surface. A mobile device having a multilevel ground-plane may include a printed circuit board, an antenna radiating element attached to a surface of the printed circuit board, and the multilevel ground plane integral with the printed circuit board and electromagnetically coupled to the antenna radiating element.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully