Method for structural enhancement of compression system board connections
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United States of America Patent
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Apr 26, 2011
Grant Date -
Mar 29, 2007
app pub date -
Sep 26, 2005
filing date -
Sep 26, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.
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