Transfer assembly for manufacturing electronic devices
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United States of America Patent
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Apr 26, 2011
Grant Date -
Jul 3, 2008
app pub date -
Jun 19, 2007
filing date -
May 16, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method for assembling a device. The method comprises placing a functional element in a first opening formed in a template substrate and transferring the functional element to a device substrate having a second opening formed therein wherein the functional element is held within the second opening and against an adhesive film coupled to the device substrate.
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