Leadframe on heat sink (LOHS) semiconductor packages and fabrication methods thereof
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United States of America Patent
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Apr 26, 2011
Grant Date -
Jun 19, 2008
app pub date -
Dec 4, 2007
filing date -
Dec 18, 2006
priority date (Note) -
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Abstract
The invention relates to leadframe semiconductor packages mounted on a heat-sink and fabrication thereof. A system in package (SiP) comprises a leadframe having extension leads, configured with divisional heat sinks serving as power and ground nets. A set of semiconductor dies is attached by adhesive on the central region of the lead frame. Pluralities of wire bonds electrically connect the set of semiconductor dies to the leadframe and to the divisional heat sinks respectively. An encapsulation encloses the leadframe, but leaves the extension leads and the divisional heat sink uncovered, exposing a heat dissipating surface.
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