Thermally enhanced electronic flip-chip packaging with external-connector-side die and method
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United States of America Patent
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Apr 26, 2011
Grant Date -
Mar 26, 2009
app pub date -
Nov 24, 2008
filing date -
Mar 5, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A method and apparatus for making a package having improved heat conduction characteristics and high frequency response. A relatively thick package substrate, such as copper, has a wiring layer bonded to one face, leaving the opposite face exposed, for example, to be a surface for connection to a heat sink. One or more chips are bonded to the wiring layer, and an array of connectors, such as solder balls are provided around the periphery of the chip(s) for connection to a printed circuit board. In some embodiments, the printed circuit board has a hole that the chip(s) extend into to allow smaller external-connection solder balls. In some embodiments, a second heat sink is connected to the back of the chip through the PCB hole.
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