Electronic devices including solder bumps on compliant dielectric layers
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United States of America Patent
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Apr 26, 2011
Issued Date -
N/A
app pub date -
Feb 5, 2007
filing date -
Feb 8, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic device may include a substrate with an input/output pad thereon, and a compliant dielectric layer on a first portion of the substrate such that a second portion of the substrate is free of the compliant dielectric layer. A conductive redistribution line may extend from the input/output pad to the compliant dielectric layer so that the compliant dielectric layer is between a bump pad portion of the conductive redistribution line and the substrate. A first solder bump may be on the bump pad portion of the conductive redistribution line so that the compliant dielectric layer is between the first solder bump and the substrate. A second solder bump may be on the second portion of the substrate that is free of the compliant dielectric layer. Related methods are also discussed.
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