Method and apparatus for three-dimensional integration of embedded power module
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United States of America Patent
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Apr 26, 2011
Grant Date -
Oct 4, 2007
app pub date -
Apr 17, 2007
filing date -
Feb 21, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A modified planar Low Temperature Co-Fired Ceramic (LTCC) high conductance inductor, embedding a large cross section conductor, supports a stacked arrangement of heat spreader, inductor and active device layers. Interlayer electrical connections connect the layers. Optionally, a DC-DC converter includes the modified planar LTCC high conductance inductor, embedding a large cross section conductor, supporting a stacked arrangement of heat spreader, capacitor and active device layers, the active devices layer including the switching transistors. The active devices layer may include semiconductor dies embedded in a substrate.
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