Packaging system including pallet de-layering system
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United States of America Patent
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May 3, 2011
Issued Date -
N/A
app pub date -
Apr 20, 2007
filing date -
Apr 20, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A packaging system for handling palletized product arranged in multiple layers of product cases, a pallet de-layering system includes a gripper mechanism. The gripper mechanism is configured to clamp a layer of the multiple layers by applying a clamping force to one or more product cases of the layer such that the layer can be removed from an adjacent layer of product cases to a different location. The layer includes a void between adjacent product cases. The gripper mechanism includes a void filling member carried by the gripper mechanism. The void filling member is sized and located to be positioned within the void to limit movement of the adjacent product cases into the void during a clamping operation.
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