Method and system for sealing a substrate
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United States of America Patent
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May 3, 2011
Grant Date -
Mar 25, 2010
app pub date -
Nov 30, 2009
filing date -
Sep 27, 2004
priority date (Note) -
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Abstract
A method of sealing a microelectromechanical system (MEMS) device from ambient conditions is described. The MEMS device is formed on a substrate and a substantially hermetic seal is formed as part of the MEMS device manufacturing process. The method may include forming a metal seal on the substrate proximate to a perimeter of the MEMS device using a method such as photolithography. The metal seal is formed on the substrate while the MEMS device retains a sacrificial layer between conductive members of MEMS elements, and the sacrificial layer is removed after formation of the seal and prior to attachment of a backplane.
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