Semiconductor components with conductive interconnects
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United States of America Patent
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May 3, 2011
Grant Date -
Aug 28, 2008
app pub date -
May 3, 2008
filing date -
May 19, 2005
priority date (Note) -
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Abstract
A semiconductor component includes a semiconductor substrate having at least one conductive interconnect on the backside thereof bonded to an inner surface of a substrate contact. A stacked semiconductor component includes multiple semiconductor components in a stacked array having bonded connections between conductive interconnects on adjacent components. An image sensor semiconductor component includes a semiconductor substrate having light detecting elements on the circuit side, and conductive interconnects on the backside.
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