MEMS devices having support structures
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United States of America Patent
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May 3, 2011
Grant Date -
Mar 1, 2007
app pub date -
Jul 21, 2006
filing date -
Jul 22, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, both rivets and posts may be used. In certain embodiments, these support structures are formed from rigid inorganic materials, such as metals or oxides. In certain embodiments, etch barriers may also be deposited to facilitate the use of materials in the formation of support structures which are not selectively etchable with respect to other components within the MEMS device.
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