Integrated circuit package system with lead structures including a dummy tie bar
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United States of America Patent
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May 3, 2011
Grant Date -
May 24, 2007
app pub date -
Nov 9, 2006
filing date -
Nov 17, 2005
priority date (Note) -
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Abstract
An integrated circuit package system includes forming lead structures including a dummy tie bar having an intersection with an outer edge of the integrated circuit package system, and connecting an integrated circuit die to the lead structures.
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